7100 XLA is available with 2" spindle or 4" spindle.
The system is capable to handle up to 18" x 24" size singulating large PCB substrates or hard and brittle glass and ceramic panels.
Features & Benefits
• Large dicing area up to 18” X 24”
• Available on the 2” spindle and 4” spindle
• Typical application: Glass panels, PCB, Ceramic, FR4 + Copper, QFN and more
• Increase theta precision for high accuracy over long cut lengths
• Easy access for maintenance
• Customized chucks configurations
• Adjustable rotating monitor + USB hub
7120/7130 Bochure.pdf
