The ADT 8230 is a high-efficiency, high-precision, high-performance and low-cost fully automatic twin-spindle dicing machine with up to 12 inches maximum workpiece size.
Features and Benefits
• Flexibility - Supports Hub and Hubless blades up to 3".O.D
• Spindles of 1.8 kW or 2.2 kW high power
(forchallenging applications)
• Intuitive operation interface using a large 17" touch screen monitor
Leading Applications
• Silicon wafers discrete devices
• Silicon carbide(SiC)
• MEMS
• SAW devices
• Glass wafer
• Packaging(QFN, LED...)
Ease of Use
The 8230 operates with the ADT intuitive New graphic User Interface (GUI), and the monitor screen is a 17" touch-screens with better flexibility and visual effects.
Other Key Features of Importance
• Highest Dicing Process Speeds - Lowest Cost
• Air spindle
• Fast automatic alignment and cut positioning for increased throughput
• Automatic Kerf check and quality analysis for maximum precision
• Process data logging and statistical analysis
• Fast & Simple Blade Change with a locking spindle shaft
• SECS / GEM platform ready
• Full access to any area of the system for easy maintenance access
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